Introduction & Objectives of the Course

Definition of a system & History of Semiconductors

Products & Levels of Packaging

Packaging Aspects of Handheld Products; Case Studies in Applications

Case Study (continued); Definition of PWB, Summary & Questions for Review

Basics of Semiconductor & Process Flowchart; Video on “Sand-to-Silicon”

Wafer Fabrication, Inspection & Testing

Wafer Packaging; Packaging Evolution; Chip Connection Choices

Wire Bonding, TAB & Flipchip-1

Wire Bonding, TAB & Flipchip-2

Why Packaging ? & Single Chip Packages or Modules (SCM)

Commonly used Packages & Advanced Packages; Materials in Packages

Advances Packages (continued); Thermal Mismatch in Packages; Current Trends in Packaging

Multichip Modules (MCM)-types; System-in-Package (SIP); Packaging Roadmaps; Hybrid Circuits; Quiz on Packages

Electrical Issues – I; Resistive Parasitic

Electrical Issues – II; Capacitive & Inductive Parasitic

Electrical Issues – III; Layout Guidelines & The Reflection Problem

Electrical Issues – IV; Interconnection

Quick Tutorial on Packages; Benefits From CAD; Introduction to DFM, DFR & DFT

Components of a CAD Package & Its Highlights

Design Flow Considerations; Beginning a Circuit Design with Schematic Work & Component Layout

Demo & Examples of Layout & Routing; Technology File Generation From CAD; DFM Check List & Design Rules; Design for Reliability

Process Flow-Chart; Vias; PWB Substrates

Substrates Continued; Video Highlights; Surface Preparation

Photoresist & Application Methods; UV Exposure & Developing; Printing Technologies for PWBs

PWB Etching; Resist Stripping; Screen-Printing Technology

Through-Hole Manufacture Process Steps; Panel & Pattern Plating Methods

Video Highlights on Manufacturing; Solder Mask for PWBs; Multilayer PWBs; Introduction to Microvias

Microvia Technology & Sequential Build-up Technology Process Flow for High-Density Interconnects

Conventional Vs HDI Technologies; Flexible Circuits; Tutorial Session

SMD Benefits; Design Issues; Introduction to Soldering

Reflow & Wave Soldering Methods to Attach SMDs

Solders; Wetting of Solders; Flux & its Properties; Defects in Wave Soldering

Vapour Phase Soldering, BGA Soldering & Desoldering/Repair; SMT Failures

SMT Failure Library & Tin Whiskers

Tin-Lead & Lead-Free Solders; Phase Diagrams; Thermal Profiles for Reflow Soldering; Lead-Free Alloys

Lead-Free Solder Considerations; Green Electronics; RoHS Compliance & E-Waste Recycling Issues

Thermal Design Considerations in Systems Packaging

Introduction to Embedded Passives; Need for Embedded Passives; Design Library; Embedded Resistor Processes

Embedded capacitors; Processes for Embedding Capacitors; Case Study Examples; Summary of Materials in Packaging

Chapter-Wise Summary