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- An Introduction to Electronics Systems Packaging
Curriculum
- 1 Section
- 42 Lessons
- 10 Weeks
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- An Introduction to Electronics Systems Packaging42
- 2.1Introduction & Objectives of the Course
- 2.2Definition of a system & History of Semiconductors
- 2.3Products & Levels of Packaging
- 2.4Packaging Aspects of Handheld Products; Case Studies in Applications
- 2.5Case Study (continued); Definition of PWB, Summary & Questions for Review
- 2.6Basics of Semiconductor & Process Flowchart; Video on “Sand-to-Silicon”
- 2.7Wafer Fabrication, Inspection & Testing
- 2.8Wafer Packaging; Packaging Evolution; Chip Connection Choices
- 2.9Wire Bonding, TAB & Flipchip-1
- 2.10Wire Bonding, TAB & Flipchip-2
- 2.11Why Packaging ? & Single Chip Packages or Modules (SCM)
- 2.12Commonly used Packages & Advanced Packages; Materials in Packages
- 2.13Advances Packages (continued); Thermal Mismatch in Packages; Current Trends in Packaging
- 2.14Multichip Modules (MCM)-types; System-in-Package (SIP); Packaging Roadmaps; Hybrid Circuits; Quiz on Packages
- 2.15Electrical Issues – I; Resistive Parasitic
- 2.16Electrical Issues – II; Capacitive & Inductive Parasitic
- 2.17Electrical Issues – III; Layout Guidelines & The Reflection Problem
- 2.18Electrical Issues – IV; Interconnection
- 2.19Quick Tutorial on Packages; Benefits From CAD; Introduction to DFM, DFR & DFT
- 2.20Components of a CAD Package & Its Highlights
- 2.21Design Flow Considerations; Beginning a Circuit Design with Schematic Work & Component Layout
- 2.22Demo & Examples of Layout & Routing; Technology File Generation From CAD; DFM Check List & Design Rules; Design for Reliability
- 2.23Review of CAD Output Files for PCB Fabrication; Photo Plotting & Mask Generation
- 2.24Process Flow-Chart; Vias; PWB Substrates
- 2.25Substrates Continued; Video Highlights; Surface Preparation
- 2.26Photoresist & Application Methods; UV Exposure & Developing; Printing Technologies for PWBs
- 2.27PWB Etching; Resist Stripping; Screen-Printing Technology
- 2.28Through-Hole Manufacture Process Steps; Panel & Pattern Plating Methods
- 2.29Video Highlights on Manufacturing; Solder Mask for PWBs; Multilayer PWBs; Introduction to Microvias
- 2.30Microvia Technology & Sequential Build-up Technology Process Flow for High-Density Interconnects
- 2.31Conventional Vs HDI Technologies; Flexible Circuits; Tutorial Session
- 2.32SMD Benefits; Design Issues; Introduction to Soldering
- 2.33Reflow & Wave Soldering Methods to Attach SMDs
- 2.34Solders; Wetting of Solders; Flux & its Properties; Defects in Wave Soldering
- 2.35Vapour Phase Soldering, BGA Soldering & Desoldering/Repair; SMT Failures
- 2.36SMT Failure Library & Tin Whiskers
- 2.37Tin-Lead & Lead-Free Solders; Phase Diagrams; Thermal Profiles for Reflow Soldering; Lead-Free Alloys
- 2.38Lead-Free Solder Considerations; Green Electronics; RoHS Compliance & E-Waste Recycling Issues
- 2.39Thermal Design Considerations in Systems Packaging
- 2.40Introduction to Embedded Passives; Need for Embedded Passives; Design Library; Embedded Resistor Processes
- 2.41Embedded capacitors; Processes for Embedding Capacitors; Case Study Examples; Summary of Materials in Packaging
- 2.42Chapter-Wise Summary